Contract assembly and processing of semiconductors: LED chip probe
We measure electrical characteristics, brightness, wavelength, and ESD. Inspections are conducted in wafer and sheet states, accommodating various specifications such as top surfaces and upper and lower electrodes!
Measurement of electrical characteristics, brightness, wavelength, and ESD. Depending on the supply form, inspections can be conducted in wafer or sheet state, accommodating various specifications such as top surface and upper and lower electrodes. Additionally, if probe testing is required from mass production to small quantities of prototypes, please feel free to consult us. 【Overview】 ■ Top surface and upper/lower electrodes: 2 to 4 inches ■ Back surface: 2 to 4 inches ■ Integrating sphere: 2 to 4 inches *For more details, please refer to the PDF document or feel free to contact us.
- 企業：函館電子
- 価格：Other
